Application · High Power

PowerPro — wafer-level SiC, GaN, and IGBT power device characterization.

Buyer profile. Power electronics engineers · EV powertrain teams · wide-bandgap device labs

The story

For years, the only way for power-semiconductor scientists and engineers to characterize their devices was at package level. Packaging is mature technology, but it adds cost and time for every batch of devices. With the Signatone PowerPro solution, users can now probe their wafer directly — up to 3 kV triax / 10 kV coax and 450 A pulsed / 10 A DC — for off-state, on-state, and current-collapse characterization.

For on-state measurement, PowerPro offers pad-level Kelvin probing on a single integrated probe — a capability unparalleled in the industry. The design lets users adjust probe size and X-Y-Z position for evolving pad layouts, and only one positioner / probe head is required per device terminal for full Kelvin capability.

The HVP-3-TX / HVP-3-CX high-voltage probe provides integrated tri-axial capability for the best high-voltage, low-current off-state measurement. The Kelvin-capable HCP-100 / HCP-450 high-current probe is the only design of its type in the industry — a multi-probe layout distributes current across the contacts and sinks heat away from the probe-pad interface to prevent overheating. Both high-voltage and high-current probes use replaceable tips for minimal interruption.

PowerPro chucks are gold-plated with zoned vacuum control for excellent contact to thin wafer backsides, with Kelvin connections for high-current and high-voltage signals. The VersaPath chuck-switch system transitions safely among floating, grounding, high-voltage bias, and high-current bias states. For arc suppression, an anti-arcing probe card uses an air-bearing chamber with compressed Clean Dry Air (CDA) — a clean, cost-effective alternative to Fluorinert.

The whole setup is built for safe high-power, high-temperature work: the PSDB probe-station dark box encloses the measurement, and the ISDB Interlock Safety Discharge Box gates discharge, main-door, access-panel, and user interlocks. Manual and semi-automatic platforms are available; high-power thermal chucks run −60 °C to 300 °C. PowerPro is ready to integrate with Keithley, Keysight, and Tektronix instrumentation.

Operating envelope

Parameter	Value
Voltage	up to 3 kV triax / 10 kV coax
Current	450 A pulsed / 10 A DC
High-voltage probe	HVP-3-TX / HVP-3-CX integrated tri-axial
High-current probe	HCP-100 / HCP-450 Kelvin, replaceable tips
Chuck	Gold-plated, zoned vacuum · VersaPath chuck switch
Thermal range	−60 °C to 300 °C high-power thermal chuck
Safety	PSDB dark box · ISDB interlock safety discharge box · anti-arcing CDA probe card
Platforms	WL350 · WL210e · CM170 (manual / semi-automatic)